FOX-XP 逻辑/存储器/光子器件的高功率测试和可靠性验证解决方案 AEHR老化失效测试系统
处理完整的晶圆/面板/单个管芯/模块以实现最高的生产量
在最终封装集成之前确定逻辑/存储器/光子管芯的失效
高功率系统，带有多达18个刀片（插槽），用于使用WaferPakTM进行晶圆或面板测试
接触器或9个刀片功能，用于单个芯片/模块DiePak®载体
可配置的频道资源
每个刀片服务器（插槽）有多个资源模块：通用通道模块，高压
通道模块或大电流通道模块
每个刀片具有多达2,048个“通用通道”资源：（I / O /时钟/ PPMU / DPS）
每通道扫描，模式化数据并捕获内存，以通过BIST / DFT测试设备
每个刀片最多可提供1,024个高压（29V）或大电流（2A）的资源
经过生产验证的全晶圆可靠性验证和测试解决方案
通过在可靠性验证过程中对晶圆/芯片/模块进行功能测试来降低测试成本
当配置有WaferPak接触器/ DiePak托架和Wafer时，可提供整体解决方案
对准器/ DiePak装载机
通过每个通道的个别过流和过压保护来保护设备
Full Wafer & Singulated Die / Module Test System
SYSTEM BENEFITS
High Throughput Reliability Verification and Test System for Volume Production
Handles full wafers / panels / singulated die / modules for highest production throughput
Identifies failing logic / memory / photonic die before final package integration
High power system with up to 18 Blades (slots) for wafer or panel testing using WaferPakTM
contactors or 9 Blade capability for singulated die / module DiePak® carriers
Configurable Channel Resources
Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage Channel Modules or High Current Channel Modules
Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep scan, pattern data and capture memory per channel for test of devices with BIST/DFT
Up to 1,024 high voltage (29V) or high current (2A) sources resources per Blade
Production Proven Full-Wafer Reliability Verification & Test Solution
Reduces test costs by functionally testing wafers/die/modules during reliability verification
Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
Aligner / DiePak Loader
Protects devices with individual per channel over-current and over-voltage protection
